Dr

Mini/Micro LED

Chip placement
  • Capacity: +180K/hr @P1 mm
  • Accuracy: +/-10um
  • w/o nozzle & robot design.
  • Break through the minimum limit of chip size and support chip minimum size scale down to 0204 mil.
  • Reduce static electricity damage
Massive Transfer Laser Bonding
  • Capacity: +180K/hr @P0.6 mm
  • Accuracy: +/-10um
  • Support minimum scale down to 0204 mil chip size/450um pixel pitch
  • Applied in high chip density(P <1.5mm) display series products
  • Massive transfer with large area (100 x100mm) enhance production efficiency
LSMT
  • Capacity: +50K/hr @P1 mm
  • Accuracy: +/-15um
  • Support minimum chip size to 0408 mil.
  • Applied in mid and low chip density, high and mid pitch(P1~10mm) backlight series products.
  • Support multi-functions switch. Optional for de-bond module or repair-module.
  • w/o reflow oven, soldering print, auxiliary material. reduce consumable cost.
Chip Sorter
  • Capacity: 80K/hr @P1 mm
  • Accuracy: +/-25um
  • Support minimum chip size down to 0305 mil
  • The # of different Bin blue tape temporary storages:150
  • Input 2 cst(26 wafer) /output: 6 cst (150 bin)